As I’ve been posting some photos of decapped ICs lately, I thought I’d share the process I use personally for those that might want to give it a go 😉 The usual method for removing the epoxy package from the silicon is to use hot, concentrated Nitric Acid. Besides the
Here is the project I’m currently working on. A completely wearable computing platform based on the Raspberry Pi & the WiFi Pineapple. Above can be seen the general overview of the current unit. On the left: Alfa AWUS036NHA USB High Power WiFi Network Interface 512MB Model B Raspberry Pi, 16GB
Here is a more modern phone, the Motorola V360v. Features include Dual screens, 640×480 VGA camera, full col our TFT Main LCD, SD-Micro slot. Here on the back the grey scale LCD can be seen, with the camera lens to the right of the Motorola logo Here the phone is